产品资料
o.6360-25 T:160um PO:150um Adhesive:10um High adhesion
日本狮力昂(Slion)UV晶片切割系列胶带:
#6360-00,#6360-20,#6360-80,#6360-15,#6360-50,#6360-25
产品特点:以具有強等方性伸特性的聚烯烴作為底基,切割時可堅固地固定物體
用途:UV照射後容易抽出晶片塗布UV剝離性膠粘劑的切割用膠帶,能使用於硅晶等,各種晶片的切割
NO.6360-25 Dicing tape (for Circuit Boards)
Product Introduction
Dicing tapes (for circuit board) consit of higher isotropic olefin backing and UV peeling adhesive.
Applications and Features
- For all kinds of substrate dicing
- Dicing tape(for Circuit Boards)
- Easy pick up
General Property
Test Item | Unit | Value |
Adhesion | | | N/10mm | 3.50 |
Tack | Ball No. | - |
Holding power | Creep mm/24h | <0.1 |
Adhesion | To UV | N/10mm | 0.24 |
*Test Method: In accordance with sliontec method.
*Holding power: 40°C, 9.8 N