I. Equipment principle:

The EVG520IS is a semi-automatic wafer bonding system designed for small batch production, with large silicon wafers up to 200mm in allowable size. Based on new EVG technology ａnd customer feedback, the EVG520IS is equipped with EVG＇s suction cup design, which provides symmetrical ａnd rapid heating ａnd cooling. Many of the EVG520IS advantages, such as independent upper ａnd lower plate heating ａnd high pressure bonding process, high degree of material ａnd process flexibility, help customers to implement bonding research ａnd production.