蓝宝石精密切割裂片机
Sapphire Material Cutting Machine

可兼容振镜和聚焦头两种裂片方式

Compatible with galvo ａnd focusing head

兼容多款国内外激光器型号，可添加CCD定位等功能模块

Compatible with a variety of domestic ａnd overseas laser models

Optional customized CCD solution ａnd other functional modules can be added

高速XY运动平台，大程度提升加工速度

High speed XY platform ensures stability under high speed processing

可切割有油墨与镀膜蓝宝石

Minimum ink offset when cutting Sapphire with deco

实现无锥度切割，边缘光滑，崩边少

Realize no taper cutting, smooth edge ａnd minimized chipping

性能参数：

应用域：

0.3mm-5mm厚度光玻璃，手机盖板、手表盖板、玻璃logo的切割倒角工艺

0.3mm-2mm sapphire, phone cover, watch cover, camera protective glass, optic protective cover filamentation ａnd separation