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扩散炉/LPCVD/diffusion and LPCVD Furnace
点击次数：163发布时间：2020/5/22 9:53:56
更新日期：2020/5/22 9:53:56
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产品型号：RCH Model 5604 5644 6844
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详细内容
RCH Associates, located in Fremont, California was founded in 1990. The company’s first charter was the manufacturer of high purity gas systems and LPCVD components related to horizontal diffusion furnaces.
With early success and 30 years of direct experience in all aspects of furnace design and processing, RCH expanded to include newly manufactured furnace systems. The key premises of the designs were to assure pristine equipment, maintenance simplicity, ruggedness and consistent process results. To this day RCH is noted as the premier
supplier of high quality furnace processing systems with close attention to cost-effectiveness and value.
To accommodate further expansion a second facility was added in early 2009.
The company continues ongoing efforts to improve all aspects of equipment design, reliability, modularity and operation ease. After 2 1/2 years of development and field-testing the ASTRA Control System was released in 2008. With ASTRA, which is fully modern and incorporates microcomputer, Ethernet and Touch Screen operation, RCH has optimized this key equipment attribute. ASTRA is available on all RCH furnace models. In addition, it may be used to upgrade most existing furnace systems and may be customized for other equipment applications.
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Standard RCH Associates' Furnace Processing Systems include:
- A loading bay comprised of a particle-free load station and non-contact, automatic cantilever loaders.
- A high performance diffusion furnace.
- A source gas cabinet or source and vacuum pump cabinet.
- Processing subsystems for atmospheric or LPCVD processes installed at each tube-level.
- The ASTRA Control System for integrated process programming and operation of all parameters.
Additional systems are available that are configured for manual or automatic push/puller loading.
A furnace system or "bank" includes 4 tube-levels that are stacked within the same footprint. The type and size of a bank is determined by the wafer or substrate size, the processes that are performed and how many wafers are to be processed in a batch.
Processing subsystems are comprised typically of a loader, a process tube or chamber that includes wafer boats and a gas delivery system. For LPCVD, a vacuum system is added. Each subsystem in a bank operates independently.
RCH processing subsystems are designed to accurately perform most any diffusion, oxidation or LPCVD process. Most processes are offered with guaranteed performance.
| Model 5604 Semiconductor applications. 75 to 150mm diameter wafers.150 to 300 wafers per batch per tube-level30 in. (762mm) thermal flat zoneCantilever, push/puller or manual loadingLPCVD or diffusion processing subsystems350 to 1350oC temperature rangeIntegrated ASTRA Control System Model 5644 Semiconductor applications. 100 to 150mm diameter wafers.200 to 400 wafers per batch per tube-level40 in. (1016mm) thermal flat zoneCantilever, push/puller or manual loadingLPCVD or diffusion processing subsystems350 to 1350oC temperature rangeIntegrated ASTRA Control System Model 6844 Semiconductor applications. 200mm diameter wafers.150 wafers per batch, typical36 in. (914.4mm) thermal flat zoneCantilever loadingLPCVD or diffusion processing subsystems400 to 1300oC temperature rangeIntegrated ASTRA Control System Model PV-6 (Photovolatics) Solar cell applications. Up to 125mm square or pseudo-square substrates.400 substrates per batchLPCVD or diffusion processing subsystemsPreferred for POCl3 emitter diffusion400 to 1300oC temperature rangeIntegrated ASTRA Control System Model PV-8 (Photovoltaics) Solar cell applications. 156mm square or pseudo-square substrates.400 substrates per batchPreferred for POCl3 emitter diffusion400 to 1300oC temperature rangeIntegrated ASTRA Control System |
中国大陆区独家销售服务商
美国赛伦科技上海办事处
吴惟雨
138 1791 5874
caven.wu@saratogatek.com
www.saratogatek.com.cn
