产品详情

No.6360-50        T:100um    PO:90um   Adhesive:10um  Easy pick-up     日本狮力昂（Slion）UV晶片切割系列胶带：   #6360-00，#6360-20，#6360-80，#6360-15，#6360-50,#6360-25   产品特点：以具有強等方性伸特性的聚烯烴作為底基，切割時可堅固地固定物體   用途：UV照射後容易抽出晶片塗布UV剝離性膠粘劑的切割用膠帶，能使用於硅晶等，各種晶片的切割     NO.6360-50 Dicing tape (for Wafer)   Product Introduction Dicing tapes (for wafer) consist of higher isotropic olefin backing ａnd UV peeling adhesive. Applications ａnd Features

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