产品：FlatMaster100 for Wafer/Disk/Industry
Principle/原理:Grazing incidence Interferometer/斜入射干涉
Accuracy/精度:0.1μm/0.1微米 
Resolution/解析度:0.01μm/0.1微米
Part Size/尺寸范围:12.5mm-100mm/12.5毫米-100毫米
Dynamic Range/动态测量范围:30μm/30微米
Data Point/数据点:Up to 250,000/达250,000以上
Measurement Time/测量时间:〈5s per Measurement/单次测量小于5s
Standard Measurements/标准测量:Flatness/Line profile/Spherical radius
Optional Measurements/可选测量:Angularity/Parallelism/Perpendicularity
Data Analysis/数据分析:3D,topographic,yield,distribution
                       X,Y,circular and radial slice
                       Flat,spherical,and conical fit data
Materials/材料:Metals/金属，Ceramics/陶瓷，Polymers/聚合体
Surface/表面:Precision ground,honed,polished and superfinished