Principle/原理:Grazing incidence Interferometer/斜入射干涉
Accuracy/精度:0.05-0.5μm（不同参数不同精度） 
Resolution/解析度:0.01μm/0.1微米
Part Size/尺寸范围:12mm-595mm/12毫米-595毫米
Dynamic Range/动态测量范围:50μm/50微米
Data Point/数据点:Up to 250,000/达250,000以上
Measurement Time/测量时间:45s/45秒
Standard Measurements/标准测量:Flatness/Line profile/Spherical radius
Data Analysis/数据分析:3D,topographic,yield,distribution
X,Y,circular and radial slice
Flat,spherical,and conical fit data
Wafer Global: 
           Front Referenced:TIR,FPD,NTD,SLICE
           Back  Referenced:TTV,TAPER,SLICE
Wafer Site:
           Front Referenced:LTIR,LFPD
           Back  Referenced:LTV,LDOF
Block:BlockCheck,Whole Block Reconstruction,Block Slice,Block Segment