C1020无氧铜

     不含氧也不含任何脱氧剂残留物的纯铜。但实际上还是含有非常微量氧和一些杂质。按标准规定，氧的含量不大于0.003%，杂质总含量不大于0.05%，铜的纯度大于99.95%。根据含氧量和杂质含量，无氧铜又分为一号和二号无氧铜。

     一号无氧铜纯度达到99.97%，氧含量不大于0.003%，杂质总含量不大于0.03%；二号无氧铜纯度达到99.95%，氧含量不大于0.003%，杂质总含量不大于0.05%。无氧铜无氢脆现象，导电率高，加工性能和焊接性能、耐蚀性能和低温性能均好。各国对于含氧量的标准也不完全相同，存在一定的差异。OFC（无氧铜）：纯度为99.995% 的金属铜。一般用于音响器材、真空电子器件、电缆等电工电子应用之中。其中无氧铜中又有 LC-OFC（线形结晶无氧铜或结晶无氧铜）：纯度在99.995%以上和OCC（单晶无氧铜）：纯度，在99.996%以上，又分为PC-OCC和UP-OCC 等。采用UP-OCC技术（Ultra Pure Copper by Ohno Continuous Casting Process）制造的单结晶无氧铜，无方向性、高纯度、防腐蚀、极低的电气阻抗使得线材适合高速优质的传输信号。
 

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The copper conductive, thermal conductivity, in the atmosphere ａnd water have high corrosion resistance, ａnd has good plasticity, easy to cold ａnd hot working, easy welding, forging ａnd tin, no stress corrosion cracking tendency, good processing performance for the majority of customer cost savings, more ａnd more by the vast number of customers in favor of. Yaotai metal special introduction of advanced equipment, high technology to provide high precision material,

     　　紫铜中的微量杂质对铜的导电、导热性能有严重影响。其中钛、磷、铁、硅等显著降低电导率,而镉、锌等则影响很小。氧、硫、硒、碲等在铜中的固溶度很小,可与铜生成脆性化合物,对导电性影响不大，但能降低加工塑性。普通紫铜在含氢或一氧化碳的还原性气氛中加热时，氢或一氧化碳易与晶界的氧化亚铜(Cu2O)作用，产生高压水蒸气或二氧化碳气体，可使铜破裂。这种现象常称为铜的“氢病”。氧对铜的焊接性有害。铋或铅与铜生成低熔点共晶，使铜产生热脆；而脆性的铋呈薄膜状分布在晶界时，又使铜产生冷脆。磷能显著降低铜的导电性,但可提高铜液的流动性,改善焊接性。适量的铅、碲、硫等能改善可切削性。紫铜退火板材的室温抗拉强度为22～25公斤力/毫米2,伸长率为45～50%，布氏硬度（HB）为35～45。 




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